PCBSky

IT-8338G IT-8338G is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.38 and is designed for the base stations, Antennas, LNBs for Direct broadcast systems and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions. Applications Next Generation Halogen free product for Base Stations, Power amplifiers LNBs for Direct Broadcast systems Antenna applications Dipole antennas Key Features Very low loss ~0.0023 at 10 GHz. Excellent dimensional stability Very stable DK/Df with Temperature Ability to use very low profile Copper for reduced insertion loss Highly suitable for Hybrids, Ability to make high layer count boards Full prepreg offering, Compatible with modif...

IT-8350G IT-8350G is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.5 and is designed for the emerging 4.5 G LTE and 5G applications requiring halogen free materials with stringent thermal stability with temperature and frequency requirements. The product is also designed for long range, short range and medium range Radars used for Autonomous driving or advanced driver assist systems operating in the 24 GHz range. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions. Applications Next Generation Halogen free product for 4 G LTE Base Stations, Power amplifiers 4.5G LTE Base stations, Antennas and PAs 24 GHz Automotive radar applications 77 GHz. SRR and MRR systems 5 G Base St...

IT-88GMW-3.0 IT-88GMW-3.0 is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material is designed for long range, short range and medium range Radars used for Autonomous driving or Advanced driver assist systems operating in the 76-81 GHz. frequency range. The product offers better dissipation factor and insertion loss than fiber reinforced PTFE products. Its higher elastic modulus helps reduce mismatch in hybrid applications. The thermal conductivity is higher than PTFE based systems and therefore the product is also suitable for demanding 5G Base stations, power amplifiers and antenna applications which are expected to operate in the mm wave range of frequencies and also require high power handling capability. The product can be paired with a full prepreg offering to build high reliability multilayer boards. The dielectric properties are very stable with temperature and therefore very suitable for thermal cycling requi...

IT-88GMW-3.15 is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material is designed for long range, short range and medium range Radars used for Autonomous driving or Advanced driver assist systems operating in the 76-81 GHz. frequency range. The product offers better dissipation factor and insertion loss than fiber reinforced PTFE products. Its higher elastic modulus helps reduce mismatch in hybrid applications. The thermal conductivity is higher than PTFE based systems and therefore the product is also suitable for demanding 5G Base stations, power amplifiers and antenna applications which are expected to operate in the mm wave range of frequencies and also require high power handling capability. The product can be paired with a full prepreg offering to build high reliability multilayer boards. The dielectric properties are very stable with temperature and therefore very suitable for thermal cycling requirements in t...

IT-8338A IT-8338A is an advanced low loss & high Tg (185° C by DSC) material for Low noise block down converter and antenna applications. The product offers low dissipation factor and insertion loss than competitive insertion loss with its use of RTF and optional Rz2 or Rz1 copper foil. The dielectric properties are stable with temperature and the product is less prone to oxidation as compared to incumbent products. Application LNB- Low noise block down converters Antenna Distributed Antenna Systems, GPS satellite Antenna Key Features Breakthrough FR-4 product with microwave grade loss performance FR-4 type processing leading to reduced cost of ownership Low loss ~0.0038 at 10 GHz. Excellent dimensional stability Stable DK/Df with Temperature Ability to use very low profile Copper for reduced insertion loss Highly suitable for Hybrids, Ability to make high layer count boards Full prepreg offering, Compatible with FR-4 processes Property Items Methods　 IT-8338A Tg (℃) DSC 185 Tg (℃)...

IT-8350A IT-8350A is an advanced low loss & high Tg (185° C by DSC) material for Low noise block down converter and antenna applications. The product offers low dissipation factor and insertion loss than competitive insertion loss with its use of RTF and optional Rz2 or Rz1 copper foil. The dielectric properties are stable with temperature and the product is less prone to oxidation as compared to incumbent products. Application LNB- Low noise block down converters Antenna Distributed Antenna Systems, GPS satellite Antenna Key Features Breakthrough FR-4 product with microwave grade loss performance FR-4 type processing leading to reduced cost of ownership Low loss ~0.0038 at 10 GHz. Excellent dimensional stability Stable DK/Df with Temperature Ability to use very low profile Copper for reduced insertion loss Highly suitable for Hybrids, Ability to make high layer count boards Full prepreg offering, Compatible with FR-4 processes Property Items Methods　 IT-8350A Tg (℃) DSC 185 Tg (℃)...

IT-8300GA IT-8300GA is an advanced ultra-low loss & high Tg (200°C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.0 and is designed for the 5G Base Stations, mmWave, Antennas and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions. Application 5G Base Stations & mmWave Antenna Key Features Low Dk 3.0 at 10 GHz Ultra-Low-Loss 0.0020 at 10 GHz Excellent dimensional stability Very stable Dk/Df with Temperature Ability to use very low profile copper for reduced insertion loss Highly suitable for Hybrids Ability to make high layer count boards Full prepreg offering, Compatible with modified FR-4 processes Property Items Methods　 IT-8300GA Tg (℃) TMA 200 T-300 (w/ 1 oz Cu, min) TMA 60+ Td-5%(℃) TGA...

IT-8615G IT-8615G is an advanced ultra-low loss & high Tg (201°C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 6.15 and is designed for the 5G Base Stations, mmWave, Antennas and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions. Application 5G Base Stations & mmWave Antenna Key Features High Dk 6.15 at 10 GHz Ultra-Low-Loss 0.0037 at 10 GHz Excellent dimensional stability Very stable Dk/Df with Temperature Ability to use very low profile copper for reduced insertion loss Highly suitable for Hybrids Ability to make high layer count boards Property Items Methods　 IT-8615G Tg (℃) TMA 201 T-300 (w/ 1 oz Cu, min) TMA 60+ Td-5%(℃) TGA 5% loss 434 CTE (ppm/℃) a1/a2 49/220 CTE (%), 50-260℃ TMA 1.9 Dk @ ...

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav...

IT-988GSETC The IT-988GSETC is an advanced low CTE, high Tg ( 180° C by TMA), halogen free, low Dk and ultra-low loss material. This material is especially designed for leading edge high speed applications, like the 56Gbps per channel data rates using PAM-2 or PAM-4 signaling. The product offers very stable dielectric properties and operates very well at 14 GHz and 28 GHz Nyquist frequencies required for 56Gbps+ data rates. The product is designed for enterprise applications ranging from >400 Gbps data rates into multi-channel terabit rates. The product uses low DK glass which helps with the skew related issues. The prepreg constructions are designed with spread glass and laminates offer multi-ply spread glass constructions to reduce the fiber weave effect. Due to very stable Dielectric properties, IT-988GSETC is also suitable for Radar and Antenna applications as well as hybrid and mixed mode RF & High Speed digital designs. IT-988GSETC also exhibits high thermal and CAF reliab...

IT-968SETC IT-968SETC is an advanced low CTE & high Tg (190° C by TMA) material. It is also an ultra low loss material with low Dk & low Df glass. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G/400G), wireless application. Due to the SI performance is stable with different environment, it is also suitable for Radar and Antenna application. IT-968SETC also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Radio Frequency Key Features 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.16 @ 10GHz) and ultra low Df (0.0037 @ 10GHz) Stable Dk/Df with different environment Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods　 IT-968SETC Tg (℃) TMA 190 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.2 Dk @ 10 GHz (RC 5...

IT-968TC The IT-968TC is an advanced low CTE, high Tg (190° C by TMA) and ultra low lossmaterial. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), wireless application.Due to the SI performance is stable with different environment, itisalsosuitable for Radar and Antenna application.IT-968TC also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Radio Frequency Key Features 100G/400G Switch solution Advanced high Tg resin technology Lower Dk(3.66@ 10GHz) and Ultra low Df (0.0050@ 10GHz) Stable Dk/Df withdifferent environment Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods　 IT-968TC Tg (℃) TMA 190 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.2 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.66 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.005...

IT-988GTC The IT-988GTC is an advanced low CTE, high Tg (180° C by TMA) and ultra low loss material. This material is especially designed for high speed data rate applications, like the 100G switch, wireless applications, backplane. With a very stable SI performances in various type of environment, IT-988GTC is also suitable for Radar and Antenna application. IT-988GTC also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Radio Frequency (RF) & Micro Wave application Key Features 100G/400G Switch solution Advanced High Tg Resin Technology Lower Dk (＜3.76 @ 10GHz) and Ultra low Df (＜0.0035 @ 10GHz) Stable Dk/Df across the frequency range Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods　 IT-988GTC Tg (℃) DSC 180 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) (52.5% resin content) a1/a2 50/270 CTE (%), 50-260℃ (52.5% resin content) TMA 2.50 Dk @ 10 GHz ...

IT-150GXTC The IT-150GXTC is a halogen free, Mid-Tg (150° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance. It is designed for low cost solution of server & base station products. Application Server Base station Key Features Halogen Free , Middle Tg and high thermal reliability Lower Dk (3.7 @ 10GHz) and low Df (0.0071 @ 10GHz) For low cost Server applications Property Items Methods　 IT-150GXTC Tg (℃) DSC 150 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 390 CTE (ppm/℃) a1/a2 40/260 CTE (%), 50-260℃ TMA 2.6 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.7 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.0071 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-150GXTC Datasheet

IT-170GLETC The IT-170GLE is an advanced HDI application, high Tg (170° C by DSC) and low Dk material. This material is designed for high storage modulus application and future any layer PWBs, also for high layer PCB application, like the handheld drive & smart phone, modify BGA board application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-170GLETC also exhibit high thermal resistant and CAF reliability. Application Smart phone Tablet Hand held drive Like BGA board Key Features For LTE, 4G and 5G hand phone solution Advanced high heat resistance and low CTE technology Lower Dk (3.14 @ 10GHz) and low Df (0.0108 @ 10GHz) Stable Dk/Df with different environment Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods　 IT-170GLETC Tg (℃) TMA 170 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 380 CTE (ppm/℃) a1/a2 40/225 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 75%...

IT-150DATC IT-150DATC is a high Tg (180° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance. IT-150DATC is designed not only for standard multilayer PWBs, but also for radar application. This material is also suitable for 3S (Server/Storage/Switch) application. Application Server/Storage/Switch Backplane Telecom Base station Radio Frequency Key Features Automotive radar application Advanced high Tg resin technology Excellent electrical performance Lower Dk (3.64 @ 10GHz) and low Df (0.0065 @ 10GHz) Stable Dk/Df with different environment Property Items Methods　 IT-150DATC Tg (℃) DSC 180 T-288 (w/ 1 Oz Cu, min) TMA >30 Td-5%(℃ ) TGA 5% loss 370 CTE (ppm/℃) a1/a2 45/250 CTE (%), 50-260℃ TMA 2.6 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.64 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.0065 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-150DATC Datasheet

IT-200LKTC IT-200LKTC is a low CTE, high Tg (200° C by DSC), multifunctional epoxy and low loss material. This material exhibit low Dk/Df and excellent reliability performance, designed not only for standard multilayer PWBs, but also for 3S(Server/Storage/Switch) application. Application Server/Storage/Switch Backplane Telecom Base station Key Features Advanced high Tg resin technology Low Dk (3.66 @ 10GHz) and low Df (0.0083 @ 10GHz) Stable Dk & Df performance Excellent reliability performance Compatible with most FR-4 processes Property Items Methods　 IT-200LKTC Tg (℃) DSC 200 T-288 (w/ 1 Oz Cu, min) TMA >30 Td-5%(℃ ) TGA 5% loss 370 CTE (ppm/℃) a1/a2 40/200 CTE (%), 50-260℃ TMA 2.5 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.66 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.0083 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-200LKTC Datasheet

IT-170GRA2TC The IT170GRA2 TC is a high Tg (175° C by DSC), halogen free epoxy and low loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for low lost low loss material and used in server/storage/ switch application . Application Server/Storage/Switch Routers Backplane Telecom Base station Key Features Halogen free,high Tg (175 o C) Lower Dk ( Compatible with High Tg standard FR 4 processes) High thermal & CAF resistance reliability Environmental friend ly materials Property Items Methods　 IT-170GRA2TC Tg (℃) DSC 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 390 CTE (ppm/℃) a1/a2 40/215 CTE (%), 50-260℃ TMA 2.4 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.8 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.008 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-170GRA2TC Datasheet

IT-958GTC IT-958GTC is a halogen free, High Tg (175° C by DSC), advanced multifunctional epoxy and low loss material. This material has low Dk and low Df performance. IT-958GTC is designed not only for standard multilayer PWBs, but also high speed 3S (Server/Storage/Switch) application. Application Server/Storage/Switch Backplane Telecom Base station Key Features Advanced high Tg resin technology Excellent electrical performance Lower Dk (3.7 @ 10GHz) and low Df (0.007 @ 10GHz) Stable Dk/Df with different environment Property Items Methods　 IT-958GTC Tg (℃) DSC 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 40/230 CTE (%), 50-260℃ TMA 2.5 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.7 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.007 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-958GTC Datasheet

IT-170GTTC The IT-170GTTC is a high Tg (185° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for Base station and 3S(server/storage/switch) application with aggressive cost. Applications Server/Storage/Switch Routers Backplane Telecom Base station Key Features Halogen free, High-Tg (185oC) Lower Dk ( Compatible with High Tg standard FR-4 processes High thermal & CAF resistance reliability Environmental friendly materials Property Items Methods　 IT-170GTTC Tg (℃) DSC 185 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 380 CTE (ppm/℃) a1/a2 45/183 CTE (%), 50-260℃ TMA 2.2 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.9 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0095 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-170GTTC Datasheet

IT-170GRA1TC The IT-170GRA1TC is a high Tg (180° C by DSC), halogen free epoxy and lower mid loss material with high thermal reliability, low CTE and CAF resistance. This green material is designed for industrial PC and 3S(server/storage/switch) application with aggressive cost. Applications Server/Storage/Switch Routers Backplane Telecom Base station Key Features Halogen free, High-Tg (180oC) Lower Dk (3.8 @ 10GHz) and low Df (0.009 @ 10GHz) Compatible with High Tg standard FR-4 processes High thermal & CAF resistance reliability Environmental friendly materials Property Items Methods　 IT-170GRA1TCTC Tg (℃) DSC 180 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 380 CTE (ppm/℃) a1/a2 40/240 CTE (%), 50-260℃ TMA 2.7 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.8 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.009 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-170GRA1TC-Data-Sheet

IT-150GTC The IT-150GTC is an general HDI application, Mid Tg (150° C by DSC) and Halogen free material. This material is designed for any layer application and easily for thin core application PWBs, also for high layer PCB application, like the handheld drive & smart phone, tablet application. Due to the Halogen free material can be achieve of environmental protection regulations, it is also suitable for exhibit high thermal resistant and CAF reliability. Application Smart phone Tablet Hand held drive Ultra book, Pad Consumers Key Features For HDI and hand phone solution Advanced High heat resistance General Dk (3.7 @ 1GHz) and Df (0.0137 @ 1GHz) Inconformity with environmental protection regulations Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods　 IT-150GTC Tg (℃) TMA 150 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 365 CTE (ppm/℃) a1/a2 35/230 CTE (%), 50-260℃ TMA 3.1 Dk @ 1 GHz (RC 50%) IPC TM-650 2.5.5.13 3.5 Df @ 1...

IT-150GSTC The IT-150GSTC is a medium Tg (155° C by DSC), halogen free multifunctional epoxy and middle loss material with high thermal reliability (18L/less than 100mil) and CAF resistance. This green material is designed for server application, especially for low cost solution. Application Server/Storage/Switch Routers Telecom Base station Key Features Halogen free, Medium-Tg (155 o C) Middle loss Compatible with FR-4 processes High thermal & CAF resistance reliability Environmental friendly materials Property Items Methods　 IT-150GSTC Tg (℃) DSC 155 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 365 CTE (ppm/℃) a1/a2 35/230 CTE (%), 50-260℃ TMA 3.1 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 3.9 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.012 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-150GSTC Datasheet

IT-158TC IT-158TC is a medium Tg (155℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly. Application Automotive (Engine room ECU) Multilayer and HDI PCB PC and Notebook Memory Module Game Player Server and Networking Telecommunications Heavy Copper Key Features Low CTE High heat resistance Excellent CAF resistance Good through-hole reliability Property Items Methods　 IT-158TC Tg (℃) DSC 155 T-288 (w/ 1oz Cu, min) TMA 20 Td-5%(℃ ) TGA 5% loss 345 CTE (ppm/℃) a1/a2 40/240 CTE (%), 50-260℃ TMA 3.3 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.0 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.018 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-158TC Data sheet

IT-258GA3TC IT-258GA3TC is a medium Tg (155℃ by DSC) halogen free multifunctional epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead free assembly. Application Automotive (Engine room ECU) Multilayer and HDI PCB Heavy Copper Key Features Advanced halogen free resin system Low CTE High heat resistance Excellent CAF resistance (1000 Volts) Good through-hole reliability High Comparative Tracking Index (CTI) and thermal conductivity Property Items Methods　 IT-258GA3TC Tg (℃) DSC 155 T-288 (w/ 1oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 385 CTE (ppm/℃) a1/a2 35/210 CTE (%), 50-260℃ TMA 2.8 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.3 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.016 CTI (Volts) EC 60112 / UL 746 400-599 Thermal Conductivity (W/mK) ASTM D5470 0.7 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-258GA3TC Datasheet

IT-180TC IT-180TC is an advanced high Tg (175℃ by DSC) multifunctional epoxy based with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly. Application Automotive Multilayer and High Layer PCB Backplanes Data Storage Server and Networking Telecommunications Heavy Copper Key Features High heat resistance Excellent CAF resistance Good through-hole reliability Property Items Methods　 IT-180TC Tg (℃) DSC 175 T-288 (w/ 1oz Cu, min) TMA 20 Td-5%(℃ ) TGA 5% loss 350 CTE (ppm/℃) a1/a2 50/250 CTE (%), 50-260℃ TMA 3.0 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.0 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.020 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-180TC Datasheet

IT-189TC IT-189TC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s suitable for automotive applications with 260℃ lead free assembly. Application Automotive (Engine room ECU) Multilayer and HDI PCB Heavy Copper Key Features Low CTE High heat resistance Excellent CAF resistance (1000 Volts) Good through-hole reliability Property Items Methods　 IT-189TC Tg (℃) DSC 175 T-288 (w/ 1oz Cu, min) TMA 25 Td-5%(℃ ) TGA 5% loss 350 CTE (ppm/℃) a1/a2 35/230 CTE (%), 50-260℃ TMA 2.4 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.1 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.016 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-189TC Datasheet

IT-180ATC IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various application and can pass 260℃ lead free assembly. Application Automotive (Engine room ECU) Multilayer and HDI PCB Backplanes Data Storage Server and Networking Telecommunications Heavy Copper Key Features Low CTE High heat resistance Excellent CAF resistance Good through-hole reliability Property Items Methods　 IT-180ATC Tg (℃) DSC 175 T-288 (w/ 1oz Cu, min) TMA 20 Td-5%(℃ ) TGA 5% loss 345 CTE (ppm/℃) a1/a2 45/210 CTE (%), 50-260℃ TMA 2.7 Dk @ 1 GHz (RC 50%) IPC TM-650 2.5.5.13 4.4 Df @ 1 GHz (RC 50%) IPC TM-650 2.5.5.13 0.015 CTI (Volts) IEC 60112 / UL 746 175-249 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-180ATC Datasheet

IT-180ITC IT-180ITC is a standard loss, high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability. It is designed for high layer count PCB and it can pass 260℃ Lead free assembly process. Application Multilayer and High Layer count PCB Backplanes Server and Networking Telecommunications Key Features Excellent CAF resistance Low CTE & Standard Loss performance Lead Free , High Tg and high thermal reliability For high layer count PCB applications Property Items Methods　 IT-180ITC Tg (℃) DSC 175 T-288 (w/ 1oz Cu, min) TMA >30 Td-5%(℃ ) TGA 5% loss 350 CTE (ppm/℃) a1/a2 40/210 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.0 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.015 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-180ITC Datasheet

IT-180GNBS IT-180GNBS no/low flow prepreg is a halogen free High Tg (175℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application. Application Rigid Flex Board Key Features Halogen-Free, Phosphorous-containing Epoxy Prepreg Superior bonding strength to bonding sheet prepreg Low powder for punching processing Minimal and uniform flow performance Good thickness uniformity and flatness Property Items Methods　 IT-180GNBS Tg (℃) DSC 175 T-288 (w/ 1oz Cu, min) TMA >30 Td-5%(℃ ) TGA 5% loss 365 CTE (ppm/℃) a1/a2 50/275 CTE (%), 50-260℃ TMA 2.9 Dk @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 4.0 Df @ 10 GHz (RC 50%) IPC TM-650 2.5.5.13 0.016 If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you. PDF Download IT-180GNBS Datasheet

 

 ENIG (Electroless Nickel Immersion Gold) is a surface plating that is applied over the copper pads on a Printed Circuit Board to protect them from corrosion and other abnormalities. Initially, the copper pad is covered by a Nickel (Ni) layer followed by a thin immersion Gold (Au) layer. ENIG provides good oxidation resistance, excellent surface planarity and allows for easy soldering which results in excellent electrical performance of the PCB board. ENIG is RoHS compliant is therefore one of the most used PCB surface finishes even though it is more complex and expensive when compared to other PCB plating process like HASL. ENIG is a two-layer metallic coating – Nickle is the barrier to the copper pad and is also the materials to which the components are soldered. Gold on the other hand protects the Nickle during storage and also provides low contact resistance. Typical Nickle thickness varies from 4 – 7 µm and Gold thickness varies from 0.05 – 0 23 µm. ENIG requires a processing...

  Hot air solver leveling is a step and process flow in the production process of PCB board. Specifically, the PCB board is immersed in the molten solder bath, so that all exposed copper surfaces will be covered by solder, and then the excess solder on PCB board will be removed by hot air cutter. Because the surface of the circuit board after spraying tin is the same material as the solder paste, the welding strength and reliability are better. However, due to its processing characteristics, the surface flatness of tin spraying treatment is not good, especially for small electronic components such as BGA package type, due to the small welding area, poor flatness may cause short circuit and other problems, so a process with better flatness is needed to solve the problem of tin spraying board. Generally, the ENIG process (note that it is not gold plating process) is selected, and the principle and method of chemical displacement reaction are used for reprocessing, and  Au ...

  With the increasingly complex and high-speed circuit design, how to ensure the integrity of various signals (especially high-speed signals), that is to say, to ensure the signal quality, has become a difficult problem. At this time, the characteristic impedance matching of the control signal trace becomes the key. If the impedance control is not strict, it will cause considerable signal reflection and signal distortion, which will lead to design failure. We all know that PCBs are printed circuit boards. Next, I will give you an answer about what is impedance control in PCB. Impedance control specifically refers to the transmission of various signals in the conductor of the circuit board. In order to improve the transmission rate, the frequency must be increased. If the circuit itself is affected by different factors such as etching, stack thickness, trace width, etc., the impedance value will be changed and the signal will be distorted. Therefore, the impedance value of...

 Board cut  is to divide a large PCB raw material into small size boards suitable for production. In PCB industry, sheet metal and cost are one of the most important indicators. Because the specifications of each batch of orders are different, the customer department needs to calculate the material and cost of the order, and then quote to the customer, and a lot of time of the engineering department is wasted in the continuous selection and assembly of materials. In PCB industry, the cost of sheet metal usually accounts for 50% of the production cost, which makes the selection of panel assembly scheme very important.