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ROGERS rt duroid 6010 PCB

The RT/duroid® 6006/6010 microwave laminate is a ceramic-filled PTFE material designed specifically for circuits or microwave applications that require high dielectric constants. The dielectric constant of RT/duroid® 6006 is 6.15 and the dielectric constant of RT/duroid® 6010LM is 10.2. RT/duroid 6006/6010 microwave laminates have the characteristics of easy processing and stable use. They have tightly controlled dielectric constant tolerance and thickness, low moisture absorption and excellent thermomechanical stability. RT/duroid 6006/6010 sheets are available with double-sided copper clad thickness from ¼ oz. to 2 oz./ft2 (8.5 to 70 μm), electrolytic copper or rolled copper are available, and thick aluminum base, brass or Red copper base metal plates are available for customization. main advantage High dielectric constant can reduce circuit size Low loss, ideal for X-band applications Strictly controlled thickness and dielectric constant tolerances are suitable for circuit
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rogers RT duroid 5880 PCB

In order to cope with the increasingly stringent requirements of high-frequency circuit design on the board, ROGERS launched a new generation of high-frequency laminate RT/duroid® 5880, which is made of PTFE glass fiber reinforced materials, and the microfibers inside the board are randomly distributed in the material Inside, it can greatly guarantee the strength of the board in the circuit application process and production process. Compared with similar materials on the market, RT/duroid® 5880 has the lowest dielectric constant, measured at 10GHz IPC-TM 2.5.5.5 standard, and its dielectric constant is 2.20±0.02. At the same time, the dielectric loss of the plate is measured under the same standard, only 0.0009. The extremely low dielectric loss makes it very suitable for high-frequency and wide-band applications that require minimum dispersion and loss. Its highest support frequency can reach Ku band or even Higher frequency. In addition, RT/duroid® 5880 has an extremely low moistur
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What is the POFV process of PCB? Why use POFV technology?

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The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
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