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pcb manufacturing process

1、CUT Cutting is the process of cutting the original copper clad laminate into boards that can be made on the production line. 2、INNER DRY FILM The inner dry film is the process of transferring the inner circuit pattern to PCB. 3. Browning Objective: to form a micro rough and organic metal layer on the inner copper surface to enhance the adhesion between layers. 4. Lamination Lamination is a process of bonding each layer of circuit into a whole with the help of the adhesion of PP sheet. This kind of bonding is realized by the diffusion and penetration of macromolecules on the interface, and then interweaving each other. The discrete multilayer board and PP sheet are pressed together to form the multilayer plate with the required number of layers and thickness. During the actual operation, copper foil, bonding sheet (semi cured sheet), inner layer plate, stainless steel, isolation plate, kraft paper, outer steel plate and other materials are laminated according to the process
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What is the POFV process of PCB? Why use POFV technology?

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The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
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A brief description on the improvement of the uniformity of VCP wire coating

First, the foreword Compared with the traditional vertical plating and cathode plating material take step is its biggest characteristic, this mode can effectively improve the electroplating quality, also covers an area reduced greatly and has its own advantage in mass production, so lately by electroplating industry of the pro Lai. The traditional vertical plating line, cathode relative to the fixed position, the anode titanium basket arrangement, plywood and splints spacing pieces on the board in the horizontal direction uniform has a significant effect, panel splints spacing, end plate position will affect the power line distribution, thus affecting the uniformity of copper plating. And to our a VCP line as an example, unilateral about 300 titanium anode baskets, the titanium basket of copper thick together plays role of an average, so single titanium basket deviation or lack of copper plating uniformity influence almost negligible. At the same time, VCP with a single hanger clip
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