pcb manufacturing process
1、CUT Cutting is the process of cutting the original copper clad laminate into boards that can be made on the production line. 2、INNER DRY FILM The inner dry film is the process of transferring the inner circuit pattern to PCB. 3. Browning Objective: to form a micro rough and organic metal layer on the inner copper surface to enhance the adhesion between layers. 4. Lamination Lamination is a process of bonding each layer of circuit into a whole with the help of the adhesion of PP sheet. This kind of bonding is realized by the diffusion and penetration of macromolecules on the interface, and then interweaving each other. The discrete multilayer board and PP sheet are pressed together to form the multilayer plate with the required number of layers and thickness. During the actual operation, copper foil, bonding sheet (semi cured sheet), inner layer plate, stainless steel, isolation plate, kraft paper, outer steel plate and other materials are laminated according to the process
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