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A brief description on the improvement of the uniformity of VCP wire coating

First, the foreword Compared with the traditional vertical plating and cathode plating material take step is its biggest characteristic, this mode can effectively improve the electroplating quality, also covers an area reduced greatly and has its own advantage in mass production, so lately by electroplating industry of the pro Lai. The traditional vertical plating line, cathode relative to the fixed position, the anode titanium basket arrangement, plywood and splints spacing pieces on the board in the horizontal direction uniform has a significant effect, panel splints spacing, end plate position will affect the power line distribution, thus affecting the uniformity of copper plating. And to our a VCP line as an example, unilateral about 300 titanium anode baskets, the titanium basket of copper thick together plays role of an average, so single titanium basket deviation or lack of copper plating uniformity influence almost negligible. At the same time, VCP with a single hanger clip
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What is the POFV process of PCB? Why use POFV technology?

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The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
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Rigid Flex PCB Design Guidelines

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 Early in the rigid flex PCB design process, it’s essential to give ample consideration to how choices made in the board design will result in reduced costs while maintaining reliability. Here we’ll lay out the general design principles that should guide a designer of rigid flex PCB’s. What is a Rigid Flex Board? A rigid flex board is a hybrid of hardboard and flexible circuits. The manufacturing process resembles that of a traditional hardboard circuit, but some of the layers are flexible circuitry that run all the way through the hardboards. The board fabricator will then add plated through holes to connect layers of rigid circuit to regions of flexible circuit. These configurations create a rigid flex PCB that can be assembled similarly to hardboards, but also fold to fit into a product with space constraints. They are also suitable for continuously flexing applications – also known as dynamic flex. Well designed, a rigid flex board can withstand hundreds of thousands of flex cycle
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