IT-180GNBS Datasheet

IT-180GNBS

IT-180GNBS no/low flow prepreg is a halogen free High Tg (175℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application.
Application

Rigid Flex Board
Key Features

Halogen-Free, Phosphorous-containing Epoxy Prepreg
Superior bonding strength to bonding sheet prepreg
Low powder for punching processing
Minimal and uniform flow performance
Good thickness uniformity and flatness
Property


Items

Methods　

IT-180GNBS


Tg (℃)

DSC

175


T-288 (w/ 1oz Cu, min)

TMA

>30


Td-5%(℃ )

TGA 5% loss

365


CTE (ppm/℃)

a1/a2

50/275


CTE (%), 50-260℃

TMA

2.9


Dk @ 10 GHz (RC 50%)

IPC TM-650 2.5.5.13

4.0


Df @ 10 GHz (RC 50%)

IPC TM-650 2.5.5.13

0.016
If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you.

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IT-180GNBS Datasheet

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