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PCB should use FR4 material if selected.

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A Guide to FR4: When Can You Use It and When Can You NotMost electrical engineers and individuals involved with printed circuit boards are familiar with the material FR4. FR4 is the backbone material upon which most rigid circuit boards are built. However, many are unaware of what FR4 is, let alone why it is the most popular PCB base.Read on to learn more about FR4 printed circuit boards, such as what they are, why they are so popular and how FR4 PCB specifications compare to other options within the industry.What Is FR4 Material? FR4, also written as FR-4, is both a name and a rating. The name is applied to the fiberglass-reinforced epoxy-laminated sheets used in printed circuit board manufacturing. However, the name also functions as a grade used to rate epoxy laminate sheets. The designation essentially indicates the base quality of a laminate sheet, meaning a variety of sheet materials and designs fall under the FR4 rating. The “FR” in the name stands for flame retardant, while t…

Wave Soldering vs. Reflow Soldering

Soldering is a huge part of the printed circuit board design process. The only reliable way to get your circuits to stick to your board and stay there is by soldering them on. Without soldering, there are no printed circuit boards. But not all types of soldering are created equal, and it can be important to differentiate between the different types of PCBs.There are two main types of soldering for PCBs: wave soldering and reflow soldering. What is the difference between the two, and how do you know which type of soldering to use in which circumstances?What Is Wave Soldering?Wave soldering is a bulk soldering process that enables one to manufacture many circuit boards in a very short amount of time. It works by passing each circuit board over a pan of molten solder. A pump in the pan creates a “wave” of solder that washes over the board, soldering the components to the board. The PCB then receives a water spray or air blowing to safely cool it and fix the parts in place.Proper tempera…

What is a Rigid Flex PCBs?

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A rigid flex printed circuit board (PCB) is a hybrid circuit board design that integrates elements from both hardboard and flexible circuits. Rigid flex PCBs are rigid at some points on the board and flexible at others. Because of this, rigid flex circuits can be folded or continuously flexed while maintaining the shape of areas that need extra support. The circuits are typically multi-layered and are comprised of flexible circuit substrates joined with rigid boards. The flexible layers are buried internally and completely penetrate the rigid sections of the PCB.One of the key benefits of a rigid flex PCB is its slim profile. The standard dielectric in flexible circuits is .001 – .002”, making it a great choice for ultra thin—and ultra light—packaging needs. Adhesiveless laminates, HDI, and thin copper layers make it ideal for fine line technology, giving you the smallest, thinnest, and lightest solution for your circuit designs.Rigid Flex TypesRigid flex PCBs support two primary appl…

RF PCB – Radio Frequency Printed Circuit Boards

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Radio frequency printed circuit boards (RF PCBs) are an exciting, fast growing sector of the PCB manufacturing industry.They are also incredibly complex with a dizzying range of options. The engineers at San Francisco Circuits can assist you with every step of the fabrication and assembly process, including material selection and key RF PCB manufacturing challenges to be aware of.What is an RF Circuit Board?In general terms, the PCB industry considers an RF circuit board to be any high frequency PCB that operates above 100MHz.Within the radio frequency class, anything above 2GHz is a Microwave PCB.What is a Microwave PCB?The main difference between RF circuit boards and Microwave PCBs is in the radio frequency in which they operate. Microwave PCBs are classified as any RF circuit board operating above 2GHz.RF circuit boards and Microwave PCBs are used for communication signals in any application that requires receiving and transmitting radio signals. For example, some common applicati…

PCB Surface Finishes Comparison: HASL LF, OSP, & ENIG

A PCB surface finish is a coating between a component and a bare board PCB. It is applied for two basic reasons: to ensure solderability, and to protect exposed copper circuitry. As there are many types of surface finishes, selecting the right one is no easy task, especially as surface mounts have become more complex and regulations such as RoHS and WEEE have changed industry standards.CriteriaConsider the following:Lead vs. Lead free*Component Type*Cost *ReworkabilityProductivityEnvironmentHASL and lead-free HASLFor decades HASL was one of the most popular surface finish choices. Yet, in recent years, manufacturers have realized its limitations. While a surface finish may be low cost and robust, fundamental changes in the PCB industry—namely, the rise complex surface mount technology—have exposed its shortcomings. HASL leaves uneven surfaces and is not suitable for fine pitch components. Although it does come in lead-free, there are other lead-free options which will likely make mor…

Rogers PCB fab

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Rogers PCB laminate are the raw materials we have chosen to one of the best. We have prepared a sufficient conventional Rogers PCB laminate stock, that can on time delivery to your Rogers PCB.ROGERS 4003C and ROGERS 4350B provide a more cost-effective and processable choice of high frequency materials than PTFE due to their excellent low dielectric loss characteristics, and are widely used in cellular base station antennas and power amplifiers, microwave point-to-point connectivity (P2P), automotive radar and sensors, radio frequency identification (RFID), high frequency head (LNB) of direct broadcast satellites, and other fields. Besides, the thermal expansion coefficient of X and Y axis is similar to the copper, and the expansion coefficient of Z axis is much lower than FR4 (46ppm/oC), and has a high Tg value (>280oC), which guarantees the good dimensional stability and high reliability of the whole product in the PCB process and assemble, and it will bring more benefits to the d…

IT-8338G Data sheet

IT-8338G

IT-8338G is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.38 and is designed for the base stations, Antennas, LNBs for Direct broadcast systems and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions.
Applications Next Generation Halogen free product for

Base Stations, Power amplifiers

LNBs for Direct Broadcast systems

Antenna applications

Dipole antennas
Key Features

Very low loss ~0.0023 at 10 GHz.

Excellent dimensional stability

Very stable DK/Df with Temperature

Ability to use very low profile Copper for reduced insertion loss

Highly suitable for Hybrids, Ability to make high layer count boards

Full prepreg offering, Compatible with modified FR-4 pro…

IT-8350G Data sheet

IT-8350G

IT-8350G is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.5 and is designed for the emerging 4.5 G LTE and 5G applications requiring halogen free materials with stringent thermal stability with temperature and frequency requirements. The product is also designed for long range, short range and medium range Radars used for Autonomous driving or advanced driver assist systems operating in the 24 GHz range. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions.
Applications Next Generation Halogen free product for

4 G LTE Base Stations, Power amplifiers

4.5G LTE Base stations, Antennas and PAs

24 GHz Automotive radar applications

77 GHz. SRR and MRR systems

5 G Base Stations…

IT-88GMW-3.0 Data sheet

IT-88GMW-3.0

IT-88GMW-3.0 is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material is designed for long range, short range and medium range Radars used for Autonomous driving or Advanced driver assist systems operating in the 76-81 GHz. frequency range. The product offers better dissipation factor and insertion loss than fiber reinforced PTFE products. Its higher elastic modulus helps reduce mismatch in hybrid applications. The thermal conductivity is higher than PTFE based systems and therefore the product is also suitable for demanding 5G Base stations, power amplifiers and antenna applications which are expected to operate in the mm wave range of frequencies and also require high power handling capability. The product can be paired with a full prepreg offering to build high reliability multilayer boards. The dielectric properties are very stable with temperature and therefore very suitable for thermal cycling requi…

IT-88GMW-3.15 Datasheet

IT-88GMW-3.15 is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material is designed for long range, short range and medium range Radars used for Autonomous driving or Advanced driver assist systems operating in the 76-81 GHz. frequency range. The product offers better dissipation factor and insertion loss than fiber reinforced PTFE products. Its higher elastic modulus helps reduce mismatch in hybrid applications. The thermal conductivity is higher than PTFE based systems and therefore the product is also suitable for demanding 5G Base stations, power amplifiers and antenna applications which are expected to operate in the mm wave range of frequencies and also require high power handling capability. The product can be paired with a full prepreg offering to build high reliability multilayer boards. The dielectric properties are very stable with temperature and therefore very suitable for thermal cycling requirements in …

IT-8338A Data sheet

IT-8338A

IT-8338A is an advanced low loss & high Tg (185° C by DSC) material for Low noise block down converter and antenna applications. The product offers low dissipation factor and insertion loss than competitive insertion loss with its use of RTF and optional Rz2 or Rz1 copper foil. The dielectric properties are stable with temperature and the product is less prone to oxidation as compared to incumbent products.
Application

LNB- Low noise block down converters
Antenna
Distributed Antenna Systems, GPS satellite Antenna
Key Features

Breakthrough FR-4 product with microwave grade loss performance
FR-4 type processing leading to reduced cost of ownership
Low loss ~0.0038 at 10 GHz.
Excellent dimensional stability
Stable DK/Df with Temperature
Ability to use very low profile Copper for reduced insertion loss
Highly suitable for Hybrids, Ability to make high layer count boards
Full prepreg offering, Compatible with FR-4 processes
Property
Items Methods  IT-8338A
Tg (℃) DSC 185
Tg (℃) TMA 180
Td-5 %( ℃…

IT-8350A Data sheet

IT-8350A

IT-8350A is an advanced low loss & high Tg (185° C by DSC) material for Low noise block down converter and antenna applications. The product offers low dissipation factor and insertion loss than competitive insertion loss with its use of RTF and optional Rz2 or Rz1 copper foil. The dielectric properties are stable with temperature and the product is less prone to oxidation as compared to incumbent products.
Application

LNB- Low noise block down converters
Antenna
Distributed Antenna Systems, GPS satellite Antenna
Key Features

Breakthrough FR-4 product with microwave grade loss performance
FR-4 type processing leading to reduced cost of ownership
Low loss ~0.0038 at 10 GHz.
Excellent dimensional stability
Stable DK/Df with Temperature
Ability to use very low profile Copper for reduced insertion loss
Highly suitable for Hybrids, Ability to make high layer count boards
Full prepreg offering, Compatible with FR-4 processes
Property
Items Methods  IT-8350A
Tg (℃) DSC 185
Tg (℃) TMA 180
Td-5 %( ℃…

IT-8300GA-Data-Sheet

IT-8300GA

IT-8300GA is an advanced ultra-low loss & high Tg (200°C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.0 and is designed for the 5G Base Stations, mmWave, Antennas and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions.
Application

5G Base Stations & mmWave
Antenna
Key Features

Low Dk 3.0 at 10 GHz
Ultra-Low-Loss 0.0020 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with Temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for Hybrids
Ability to make high layer count boards
Full prepreg offering, Compatible with modified FR-4 processes
Property
Items Methods  IT-8300GA
Tg (℃) TMA 200
T-300 (w/ 1 oz Cu, min) TMA 60+
Td-5%(℃) TGA 5% loss 433
CTE (…

IT-8615G-Data-Sheet

IT-8615G

IT-8615G is an advanced ultra-low loss & high Tg (201°C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 6.15 and is designed for the 5G Base Stations, mmWave, Antennas and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions.
Application

5G Base Stations & mmWave
Antenna
Key Features

High Dk 6.15 at 10 GHz

Ultra-Low-Loss 0.0037 at 10 GHz

Excellent dimensional stability

Very stable Dk/Df with Temperature

Ability to use very low profile copper for reduced insertion loss

Highly suitable for Hybrids

Ability to make high layer count boards
Property
Items Methods  IT-8615G
Tg (℃) TMA 201
T-300 (w/ 1 oz Cu, min) TMA 60+
Td-5%(℃) TGA 5% loss 434
CTE (ppm/℃) a1/a2 49/220
CTE (%), 50-260℃ TMA 1.9
Dk @ 10 GHz IPC TM-650 2…

IT-968G Data sheet rev 1.0-20

IT-968G

The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability.
Application

Server/Storage/Switch

Backplane

Telecom

Base station
Key Features

Halogen free material

100G/400G Switch solution

Advanced high Tg resin technology

Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz)

Stable Dk/Df with different environment condition

Compatible with modified FR-4 processes

High thermal & CAF reliability
Property

Items Methods IT-968G
Tg (℃) TMA 175
T-288 (w/ 1 Oz Cu, min) TMA >60
Td-5%(℃ ) TGA 5% loss 400
CTE (ppm/℃) a1/a2 45/260
CTE (%), 50-260℃ TMA 2.3
Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59
Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050

If you have PCB to produce, please…