A brief description on the improvement of the uniformity of VCP wire coating
First, the foreword Compared with the traditional vertical plating and cathode plating material take step is its biggest characteristic, this mode can effectively improve the electroplating quality, also covers an area reduced greatly and has its own advantage in mass production, so lately by electroplating industry of the pro Lai. The traditional vertical plating line, cathode relative to the fixed position, the anode titanium basket arrangement, plywood and splints spacing pieces on the board in the horizontal direction uniform has a significant effect, panel splints spacing, end plate position will affect the power line distribution, thus affecting the uniformity of copper plating. And to our a VCP line as an example, unilateral about 300 titanium anode baskets, the titanium basket of copper thick together plays role of an average, so single titanium basket deviation or lack of copper plating uniformity influence almost negligible. At the same time, VCP with a single hanger clip
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