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IT-968G Data sheet rev 1.0-20

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav...
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How pcb is manufactured?

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 The manufacturing of a Printed Circuit Board (PCB) is a complex process that involves several steps. Here is an overview of how PCBs are typically manufactured: 1. Design and Layout: The PCB manufacturing process begins with the design and layout of the PCB. Designers use PCB design software to create a schematic diagram of the circuit and then lay out the components and traces on the PCB to ensure proper connectivity. 2. Gerber File Generation: Once the design is complete, the designer generates Gerber files. These files contain detailed information about the PCB's layers, component placements, and traces. Gerber files are essential for the fabrication process. 3. Material Selection: The next step involves selecting the materials for the PCB. The most common material is FR-4, a type of fiberglass-reinforced epoxy laminate. The choice of material depends on factors like the PCB's intended application and required electrical properties. 4. Panelization: Multiple PCBs are ofte...
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What is the POFV process of PCB? Why use POFV technology?

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The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop...
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