IT-170GLETC Data sheet

IT-170GLETC

The IT-170GLE is an advanced HDI application, high Tg (170° C by DSC) and low Dk material. This material is designed for high storage modulus application and future any layer PWBs, also for high layer PCB application, like the handheld drive & smart phone, modify BGA board application. Due to the low Dk respectively can stable with high frequency, it is also suitable for halogen free application. IT-170GLETC also exhibit high thermal resistant and CAF reliability.
Application

Smart phone
Tablet
Hand held drive
Like BGA board
Key Features

For LTE, 4G and 5G hand phone solution

Advanced high heat resistance and low CTE technology

Lower Dk (3.14 @ 10GHz) and low Df (0.0108 @ 10GHz)

Stable Dk/Df with different environment

Compatible with modified FR-4 processes

High thermal & CAF reliability
Property


Items

Methods　

IT-170GLETC


Tg (℃)

TMA

170


T-288 (w/ 1 Oz Cu, min)

TMA

>60


Td-5%(℃ )

TGA 5% loss

380


CTE (ppm/℃)

a1/a2

40/225


CTE (%), 50-260℃

TMA

2.3


Dk @ 10 GHz (RC 75%)

IPC TM-650 2.5.5.13

3.14


Df @ 10 GHz (RC 75%)

IPC TM-650 2.5.5.13

0.0108
If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you.

PDF Download

IT-170GLETC Datasheet

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