IT-8300GA is an advanced ultra-low loss & high Tg (200°C by TMA) material for demanding Radio frequency applications. The material has a Dielectric constant of 3.0 and is designed for the 5G Base Stations, mmWave, Antennas and other RF applications. The product offers better dissipation factor and insertion loss than fiber reinforced Hydrocarbon materials. The product can be paired with a full prepreg offering to build high reliability multilayer boards or with other ITEQ materials for Hybrid constructions.

5G Base Stations & mmWave
Key Features

Low Dk 3.0 at 10 GHz
Ultra-Low-Loss 0.0020 at 10 GHz
Excellent dimensional stability
Very stable Dk/Df with Temperature
Ability to use very low profile copper for reduced insertion loss
Highly suitable for Hybrids
Ability to make high layer count boards
Full prepreg offering, Compatible with modified FR-4 processes
Items Methods  IT-8300GA
Tg (℃) TMA 200
T-300 (w/ 1 oz Cu, min) TMA 60+
Td-5%(℃) TGA 5% loss 433
CTE (ppm/℃) a1/a2 65/280
CTE (%), 50-260℃ TMA 3.2
Dk @ 10 GHz IPC TM-650 3.0
Df @ 10 GHz IPC TM-650 0.0020

If you have PCB to produce, please send Gerber to .Thank you.

PDF Download



Popular posts from this blog

PCB Design, Manufacturing & Assembling

What is the POFV process of PCB? Why use POFV technology?

IT-968G Data sheet rev 1.0-20