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What is the POFV process of PCB? Why use POFV technology?

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The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
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IT-88GMW-3.0 Data sheet

IT-88GMW-3.0 IT-88GMW-3.0 is an advanced ultra-low loss & high Tg (185° C by TMA) material for demanding Radio frequency applications. The material is designed for long range, short range and medium range Radars used for Autonomous driving or Advanced driver assist systems operating in the 76-81 GHz. frequency range. The product offers better dissipation factor and insertion loss than fiber reinforced PTFE products. Its higher elastic modulus helps reduce mismatch in hybrid applications. The thermal conductivity is higher than PTFE based systems and therefore the product is also suitable for demanding 5G Base stations, power amplifiers and antenna applications which are expected to operate in the mm wave range of frequencies and also require high power handling capability. The product can be paired with a full prepreg offering to build high reliability multilayer boards. The dielectric properties are very stable with temperature and therefore very suitable for thermal cycling requi
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IT-968G Data sheet rev 1.0-20

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav
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