Role of auxiliary components in hard gold plating PCB plating solution
Electroplating can be divided into hard gold and soft gold. Hard gold electroplating is an alloy, so its hardness is relatively hard. It is suitable for use in places requiring force and friction. It is generally used as the edge contact point of PCB (commonly known as golden finger). Soft gold, On the other hand, is commonly used to connect aluminum wires On the COB (Chip On Board) or On the touch surface of mobile phone keys, and more recently, it is widely used On both sides of BGA boards. The distinction of hard gold and soft gold, it is the component of this layer of gold that goes up finally plating, when gold-plating can choose electroplate pure gold or alloy, because the hardness of pure gold is softer, so also call "soft gold". Function of auxiliary components in PCB plating hard gold plating solution : Boric acid ACTS: as a buffer, which can maintain a relatively balanced PH value of hard gold-plated PCB plating solution with a concentration of 35~55g/l; ...