Edge Plating/Half-hole PCB



Edge Plating/Half-hole PCB

Hard Gold PCB HARD GOLD PCBVia in Pad VIA IN PAD

PCB FABRICATION

Conventional PCB

Impedance Control PCB

Gold Fingers PCB

Hard Gold PCB

Thick / Heavy Copper PCB

Edge Plating/Half-hole PCB

High Tg PCB

Via in Pad

Metal Core PCB

High Frequency PCB

Flexible PCB

Blind & Buried VIA Hole PCB

SMT Assembly

Rigid-flex PCB

ARTICLE

Distinguish between Hard Gold and Soft Gold

What Is A Printed Circuit Board?

Design Type of Aluminum Printed Circuit Board

Manufacturing Structure of Multilayer Flexible Printed Board

CONATCT

Tel: +86-755-33583558 Ext 603

E-mail: service@pcbsky.com

Add: 407, Kanglan Fortune Center, Fuzhou Avenue, Fuyong Street, Baoan District, Shenzhen, Guangdong 518103, China

Half hole pcb

The walls of the PTH holes on the PCB are plated with Half-hole formed by smooth and complete metal forming.The Half hole process on the edge of the board is already a mature process in PCBSKY PCB manufacturing processing.

How to control product quality after forming half holes on the edge of the circuit board? For example, copper debris and residues on the hole walls have always been a problem in PCB edge plating process.

This type of board has a row of half hole in the PCB, which is characterized by a relatively small aperture, mostly used on the carrier board, as a daughter board of the motherboard, through the half-hole and the motherboard and components The feet are welded together.

Therefore, if there are copper thorns remaining in these half-hole, the soldering of the plug-in manufacturers will result in inaccurate solder joints and weak soldering, which will cause a bridge short circuit between the two pins.

Half hole pcb has a minimum processing capacity of 0.4 mm for the sample and a minimum of 0.5 mm for the batch.

Edge Plating does not have a set definition per IPC. However, the industry generally accepts this as being copper plating that continues from the top and bottom surfaces and along one or more perimeter edges. The process of Edge Plating PCB can be used for a variety of purposes, including, but not limited to edge soldering, edge connections, and to increase current carrying capacity. Burrs Often edge plating, especially on castellations, can result in burrs from the final machining process.

We apply a modified, proprietary process flow that results in the burrs being polished down to the edge of the feature. Copper Peeling Plating over a large substrate surface can lead to the plated copper peeling due to a lack of adhesion strength. We address this by first roughening the surface through a combination of chemical and other proprietary means. We then use direct metallization, which has a higher copper bond strength, to prepare the surface for plating.

Welcome to custom Edge Plating PCB / Half Hole PCB directly from PCB Factory at low cost.

CUSTOM PCB CHINA FABRICATION

PCBSKY is a professional PCB/FPC manufacturer in China, providing full PCB fabrication services in certified quality standards. We specialize in quick turn PCB & prototypes.








Comments

Post a Comment

Popular posts from this blog

PCB Design, Manufacturing & Assembling

In this article, you'll get to know the fundamentals of PCB manufacturers and how our company "PCBSKY" is unique from other manufacturers in China. What are the three main aspects of the PCB industry?   According to our experience of more than 10 years as the leading PCB Company in the industry, we can easily write that three main aspects in the PCB industry for which most clients look for are: PCB Design PCB Manufacturing  PCB Assembly Design, Manufacturing, and assembling of PCB is a systematic method for examining the parts and components which is needed to execute. It included obtaining costs of a commodity and seeks to cut costs before actual development begins. There are specific manufacturing, design, and assembling principles required to be following during the PCB process execution of any electrical or electronics part. Eventually, a final design concludes the series with a review among the most common issues related to the PC Board or Printed Circuit Board.
Read more

What is the POFV process of PCB? Why use POFV technology?

Image
The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
Read more

IT-968G Data sheet rev 1.0-20

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav
Read more