PCB Design Experience Summary: 10 Rules for Component Layout

1. Custom pcb fabrication follows the layout principle of “first big, then small, first difficult and easy”, that is, important unit circuits and core components should be prioritized.

2. The layout should refer to the principle block diagram, and arrange the main components according to the main signal flow direction of the board.

3. The arrangement of components should be easy to debug and repair, that is, there should be no space around the small components, and there should be enough space around the components to be debugged.

4. For the same structural circuit part, use the "symmetric" standard layout as much as possible.

5. Optimize the layout according to the standard of uniform distribution, balance of center of gravity, and beautiful layout.

6. The same type of instrumented components should be placed in one direction in the X or Y direction. The same type of polar discrete components must also strive to be consistent in the X or Y direction for ease of production and inspection.

7. The heating elements should be evenly distributed to facilitate the heat dissipation of the single board and the whole machine. Temperature sensitive components other than the temperature detecting components should be kept away from the components with large heat generation.

8. Custom pcb fabrication layout should try to meet the following requirements: the total connection is as short as possible, and the key signal line is the shortest. High voltage, high current signal and small current, low voltage weak signal are completely separated. Analog signal is separated from digital signal. The frequency signal is separated from the low frequency signal. The interval between the high frequency components should be sufficient.

9. The layout of the decoupling capacitor should be as close as possible to the power supply pin of the IC, and the loop formed between the power supply and the ground should be the shortest.

10. When customizing the layout of pcb components, it should be considered that devices using the same power supply should be placed together as much as possible to facilitate future power separation.

Comments

Post a Comment

Popular posts from this blog

PCB Design, Manufacturing & Assembling

In this article, you'll get to know the fundamentals of PCB manufacturers and how our company "PCBSKY" is unique from other manufacturers in China. What are the three main aspects of the PCB industry?   According to our experience of more than 10 years as the leading PCB Company in the industry, we can easily write that three main aspects in the PCB industry for which most clients look for are: PCB Design PCB Manufacturing  PCB Assembly Design, Manufacturing, and assembling of PCB is a systematic method for examining the parts and components which is needed to execute. It included obtaining costs of a commodity and seeks to cut costs before actual development begins. There are specific manufacturing, design, and assembling principles required to be following during the PCB process execution of any electrical or electronics part. Eventually, a final design concludes the series with a review among the most common issues related to the PC Board or Printed Circuit Board.
Read more

What is the POFV process of PCB? Why use POFV technology?

Image
The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop
Read more

IT-968G Data sheet rev 1.0-20

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav
Read more