Basic Structure of Multilayer Flexible PCB

The basic structure of a multilayer flexible PCB is as follows:

Copper foil:It is basically divided into electrolytic copper and rolled copper. Common in thickness are 1oz 1/2oz and 1/3 oz.
Substrate film: It is commonly used in thicknesses of 1 mil and 1/2 mil.
Glue (adhesive): Thickness depends on customer requirements.

Multilayer flexible PCB cover film protection film (Cover Film)

Cover film protection film: It is used for surface insulation. Common thickness is 1mil and 1/2mil.
Glue (adhesive): Thickness depends on customer requirements.
Release paper: It prevents the adhesive from sticking to foreign objects before pressing and easy to work.

Multilayer flexible PCB reinforcing plate (PI Stiffener Film)

Reinforcement plate: It reinforces the mechanical strength of FPC and facilitates surface mounting operations. Common thicknesses range from 3 mils to 9 mils.
Glue (adhesive): Thickness depends on customer requirements.
Release paper: It prevents the adhesive from sticking to foreign objects before pressing.
EMI: Electromagnetic shielding film protects the circuit inside the circuit board from external interference (strong electromagnetic area or susceptible area).

Comments

Post a Comment

Popular posts from this blog

What is the POFV process of PCB? Why use POFV technology?

Image
The process flow of POFV has become more and more widely used in the PCB industry in recent years, especially in some products with high layers and large board thickness, which is very popular. People hope to use resin plug holes to solve a series of problems that cannot be solved by using green oil plug holes or pressure-filled resin. However, due to the characteristics of the resin itself used in this process, many difficulties need to be overcome in manufacturing to achieve good quality resin plug products. With the continuous updating of electronic product technology, the structure and installation method of electronic chips are constantly improving and changing. Its development is basically from components with plug-in feet to highly dense integrated circuit modules using ball matrix arrangement of solder joints. You can see the development history of parts from the following figure: In the PCB industry, many process methods have been widely used in the industry, and peop...
Read more

IT-968G Data sheet rev 1.0-20

IT-968G The IT-968G is an advanced low CTE, high Tg (175° C by TMA), Halogen free and ultra low loss material. This material is designed not only for standard multilayer PWBs, but also for high speed data rate application, like the switch (100G), Base station application. IT-968G SI performance is stable with variety environment condition, it is also exhibit high thermal and CAF reliability. Application Server/Storage/Switch Backplane Telecom Base station Key Features Halogen free material 100G/400G Switch solution Advanced high Tg resin technology Lower Dk (3.59 @ 10GHz) and Ultra low Df (0.0050 @ 10GHz) Stable Dk/Df with different environment condition Compatible with modified FR-4 processes High thermal & CAF reliability Property Items Methods IT-968G Tg (℃) TMA 175 T-288 (w/ 1 Oz Cu, min) TMA >60 Td-5%(℃ ) TGA 5% loss 400 CTE (ppm/℃) a1/a2 45/260 CTE (%), 50-260℃ TMA 2.3 Dk @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 3.59 Df @ 10 GHz (RC 55%) IPC TM-650 2.5.5.13 0.0050 If you hav...
Read more

PCB Design, Manufacturing & Assembling

In this article, you'll get to know the fundamentals of PCB manufacturers and how our company "PCBSKY" is unique from other manufacturers in China. What are the three main aspects of the PCB industry?   According to our experience of more than 10 years as the leading PCB Company in the industry, we can easily write that three main aspects in the PCB industry for which most clients look for are: PCB Design PCB Manufacturing  PCB Assembly Design, Manufacturing, and assembling of PCB is a systematic method for examining the parts and components which is needed to execute. It included obtaining costs of a commodity and seeks to cut costs before actual development begins. There are specific manufacturing, design, and assembling principles required to be following during the PCB process execution of any electrical or electronics part. Eventually, a final design concludes the series with a review among the most common issues related to the PC Board or Printed Circuit Board....
Read more