pcb manufacturing process
1、CUT
Cutting is the process of cutting the original copper clad laminate into boards that can be made on the production line.
2、INNER DRY FILM
The inner dry film is the process of transferring the inner circuit pattern to PCB.
3. Browning
Objective: to form a micro rough and organic metal layer on the inner copper surface to enhance the adhesion between layers.
4. Lamination
Lamination is a process of bonding each layer of circuit into a whole with the help of the adhesion of PP sheet. This kind of bonding is realized by the diffusion and penetration of macromolecules on the interface, and then interweaving each other. The discrete multilayer board and PP sheet are pressed together to form the multilayer plate with the required number of layers and thickness. During the actual operation, copper foil, bonding sheet (semi cured sheet), inner layer plate, stainless steel, isolation plate, kraft paper, outer steel plate and other materials are laminated according to the process requirements.
5. Drilling
Through holes are generated between layers of circuit boards to achieve the purpose of connecting layers.
6. Copper plate plating
7. Outer dry membrane
8. Outer pattern plating, SES
The hole and circuit copper layer is plated to a certain thickness (20-25um) to meet the requirements of the final PCB copper thickness. And etch the useless copper on the board surface to reveal useful circuit patterns.
9. Resistance welding
Solder mask, also known as solder proof, green oil, is one of the most critical processes in PCB production. It is mainly through screen printing or coating solder resist ink, coating a layer of solder mask on the surface of the board. Through exposure and development, expose the plate and hole to be welded, and cover other places with solder mask to prevent short circuit during welding
10. Silk screen characters
The required text, trademark or part symbol are printed on the board in the form of screen printing, and then exposed on the board surface by ultraviolet radiation.
11. Surface treatment
The solderability of bare copper is very good, but it is easy to be oxidized by moisture when exposed to the air for a long time. It tends to exist in the form of oxide and is unlikely to remain as the original copper for a long time. Therefore, the surface treatment of copper surface is necessary. The basic purpose of surface treatment is to ensure good solderability or electrical properties.
Common surface treatment:HSL, ENIG, OSP, electric hard gold, electric gold finger, etc.
12. Molding
The PCB is cut into the required size by CNC molding machine.
13. Electrical measurement
Simulate the state of the board, power on for electrical performance check, whether there is open or short circuit.
14. Final inspection, sampling test and packaging
Check the appearance, size, hole diameter, thickness and mark of the plate to meet the requirements of customers. The qualified products are packed into bundles for easy storage and transportation.
Cutting is the process of cutting the original copper clad laminate into boards that can be made on the production line.
2、INNER DRY FILM
The inner dry film is the process of transferring the inner circuit pattern to PCB.
3. Browning
Objective: to form a micro rough and organic metal layer on the inner copper surface to enhance the adhesion between layers.
4. Lamination
Lamination is a process of bonding each layer of circuit into a whole with the help of the adhesion of PP sheet. This kind of bonding is realized by the diffusion and penetration of macromolecules on the interface, and then interweaving each other. The discrete multilayer board and PP sheet are pressed together to form the multilayer plate with the required number of layers and thickness. During the actual operation, copper foil, bonding sheet (semi cured sheet), inner layer plate, stainless steel, isolation plate, kraft paper, outer steel plate and other materials are laminated according to the process requirements.
5. Drilling
Through holes are generated between layers of circuit boards to achieve the purpose of connecting layers.
6. Copper plate plating
7. Outer dry membrane
8. Outer pattern plating, SES
The hole and circuit copper layer is plated to a certain thickness (20-25um) to meet the requirements of the final PCB copper thickness. And etch the useless copper on the board surface to reveal useful circuit patterns.
9. Resistance welding
Solder mask, also known as solder proof, green oil, is one of the most critical processes in PCB production. It is mainly through screen printing or coating solder resist ink, coating a layer of solder mask on the surface of the board. Through exposure and development, expose the plate and hole to be welded, and cover other places with solder mask to prevent short circuit during welding
10. Silk screen characters
The required text, trademark or part symbol are printed on the board in the form of screen printing, and then exposed on the board surface by ultraviolet radiation.
11. Surface treatment
The solderability of bare copper is very good, but it is easy to be oxidized by moisture when exposed to the air for a long time. It tends to exist in the form of oxide and is unlikely to remain as the original copper for a long time. Therefore, the surface treatment of copper surface is necessary. The basic purpose of surface treatment is to ensure good solderability or electrical properties.
Common surface treatment:HSL, ENIG, OSP, electric hard gold, electric gold finger, etc.
12. Molding
The PCB is cut into the required size by CNC molding machine.
13. Electrical measurement
Simulate the state of the board, power on for electrical performance check, whether there is open or short circuit.
14. Final inspection, sampling test and packaging
Check the appearance, size, hole diameter, thickness and mark of the plate to meet the requirements of customers. The qualified products are packed into bundles for easy storage and transportation.
If you have PCB to produce, please send Gerber to sales@pcbsky.com.cn .Thank you.
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